DIEM

Welcome to the DIEM

Devices and Interoperability Ecosystem - DIEM - project is part of the Finnish ICT SHOK program coordinated by TIVIT.

DIEM project targets to define and open a completely new domain for technology and service innovation in a global scale. The project targets to enable news services and applications that are based smart environments that comprise of digital devices containing relevant information for different purposes. The key is interoperability between devices from different domains.

The big mission of the project is to create the concept and implementation of generic and scalable smart space interoperability solution and platform, which can be adapted to various domains and application. The main drivers are multivendor device environments; ease on use and intuitivity, and new application development paradigm.

Concrete breakthroughs will be

  • Internet like revolution in local spaces with interoperability solution that can scale to different domains and adopt to device legacy
  • Smart application creation scheme, which mobilizes the domain experts and users of environments as the application developers
  • Cutting edge research contribution in the global smart space and ubicom research area through journal

The basic structure of the project is an integrated project, which has a dual approach of vertical work packages for selected application areas and horizontal work packages driven the key elements of creating the ecosystem for device interoperability.

Major project deliverables are

  • Interoperability platform, which will evolve to de-facto standard
  • Common user interaction methods and solutions that provide ease of use and can foster adoption of new services across different domains and spaces
  • New kinds of application and services in the piloted areas, which represent new ways of working, and which are basis for new businesses
  • Smart space demonstrators integrating shared information and services from several domains demonstrating the capability of open innovation platform.

Work packages for the first project year (Jun 2008 - Jun 2009) are organized as horinzontal technical work and vertical application-specific work. The work packages are collaborating in close interaction.

DIEM